نوع مقاله : مقاله پژوهشی
عنوان مقاله English
نویسندگان English
Heat sinks play a crucial role in the cooling of electronic equipment. In this study, a novel approach is adopted by employing a commonly used microchannel heat sink containing a nanofluid. Single-walled carbon nanotube nanoparticles are homogeneously dispersed in the base fluid (water). Two heat sink models made of copper are investigated, including commercial copper with a lower thermal conductivity and high-thermal-conductivity copper. Numerical simulations are performed for Reynolds numbers of 250, 350, 450, and 550 and nanoparticle volume concentrations of 0.5, 1, 1.5, and 2%. The governing equations of continuity, momentum, energy, and the volume fraction of the particle phase are solved using the finite volume method. The results indicate that the best thermal performance is achieved at a Reynolds number of 500 and a nanoparticle concentration of 2%. Furthermore, the effect of changing the heat sink material shows that the difference in the Nusselt number between the two models is not significant.
کلیدواژهها English
